Thermally Conductive Epoxy Delivers Heat Resistance & Electrical Insulation

Master Bond Inc.
154 Hobart St
Hackensack
NJ
07601
United States

Tel: 201-343-8983
Fax: 201-343-2132

Master Bond has developed a thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits.

With a thermal conductivity over 22 BTU•in/ft2•hr•ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.

This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.

Cryogenically Serviceable Epoxy Meets NASA Low-Outgassing Specifications Sep 13, 2010Thermally Resistant Epoxy Features Glass Transition Temperature Exceeding 220ºC Jul 9, 2010UV Curable Adhesive/Sealant Meets NASA Low Outgassing Requirements Jul 8, 2010Epoxy Meets NASA Low Outgassing Specifications and is Cryogenically Serviceable Nov 12, 2010Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Requirements Oct 1, 2010Flexibilized Epoxy Combines High Strength and Toughness with Chemical Resistance Sep 9, 2010Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability Sep 8, 2010Reinforced Epoxy Adhesive Improves Structural Bonding Jan 18, 2010Non Yellowing Permanent/ Temporary Adhesive Cures Rapidly Jan 14, 2010

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Epoxy Meets NASA Low Outgassing Specifications and is Cryogenically Serviceable

Master Bond Inc.
154 Hobart St
Hackensack
NJ
07601
United States

Tel: 201-343-8983
Fax: 201-343-2132

Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.

It withstands cryogenic temperatures and meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications. EP21TDCHT-LO has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures.
As a toughened system, EP21TDCHT-LO is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has an outstanding service temperature range from 4K to +350ºF. Other notable features include a shear strength exceeding 2500 psi, a peel strength of greater than 20 pli, and a Shore D hardness of greater than 60.

Cryogenically Serviceable Epoxy Meets NASA Low-Outgassing Specifications Sep 13, 2010Thermally Resistant Epoxy Features Glass Transition Temperature Exceeding 220ºC Jul 9, 2010UV Curable Adhesive/Sealant Meets NASA Low Outgassing Requirements Jul 8, 2010Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Requirements Oct 1, 2010Flexibilized Epoxy Combines High Strength and Toughness with Chemical Resistance Sep 9, 2010Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability Sep 8, 2010Reinforced Epoxy Adhesive Improves Structural Bonding Jan 18, 2010Non Yellowing Permanent/ Temporary Adhesive Cures Rapidly Jan 14, 2010High Temperature Sealant / Coating for Service Above 500°F Dec 3, 2009

View the original article here