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With a thermal conductivity over 22 BTU•in/ft2•hr•ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.
This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.Cryogenically Serviceable Epoxy Meets NASA Low-Outgassing Specifications Sep 13, 2010Thermally Resistant Epoxy Features Glass Transition Temperature Exceeding 220ºC Jul 9, 2010UV Curable Adhesive/Sealant Meets NASA Low Outgassing Requirements Jul 8, 2010Epoxy Meets NASA Low Outgassing Specifications and is Cryogenically Serviceable Nov 12, 2010Ultra-Fast Curing, Thermally Stable Epoxy Meets NASA Low Outgassing Requirements Oct 1, 2010Flexibilized Epoxy Combines High Strength and Toughness with Chemical Resistance Sep 9, 2010Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability Sep 8, 2010Reinforced Epoxy Adhesive Improves Structural Bonding Jan 18, 2010Non Yellowing Permanent/ Temporary Adhesive Cures Rapidly Jan 14, 2010